Micro-sectioning approach for quality and reliability assessment of wire bonding interfaces in IGBT modules
نویسندگان
چکیده
A micro-sectioning approach for characterizing the quality or degradation state of interconnect interfaces in electronic components is described. The method is presented as a means of investigating the bonding quality of the Al wedge bonding process in IGBT modules. Micro-sectioning approach for quality and reliability assessment of wire bonding interfaces in IGBT modules Kristian Bonderup Pedersen, Peter Kjær Kristensen, Vladimir Popok & Kjeld Pedersen Department of Physics and Nanotechnology
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ورودعنوان ژورنال:
- Microelectronics Reliability
دوره 53 شماره
صفحات -
تاریخ انتشار 2013